(LF) PowerOne
Ideal for versatile & customizable applications
REACH- and RoHS-compliant one-piece (LF) PowerOne Powerelements allow you to supply and distribute high currents to PCBs. Flexibly configurable and available in thousands of variations, they are ideal for fuses and cable connections to the PCB or as mounting elements. For PCB mounting, the range offers several options: Press-in, SMT, THT and THR.
Depending on the pin configuration and layout, currents of up to 1,000 amperes can be carried.
Product overview PowerOne Press-fit (PDF)
Product overview PowerOne SMD (PDF)
The lead-free version (LF PowerOne) of PowerOne Powerelements is also available:
Key information at a glance
Application possibilities
- Contacting / fastening of switches, fuses, etc.
- Wire-to-board for screwing ring cable lugs
- Board-to-board
- Electromechanics such as housing fastening and spacers
From sample to market
Samples are available even in small quantities. Individual Powerelements for series production are also no problem.
Just tell us what you need!
Packaging
Flexible packaging options: bulk, trays or in blister on reel for cost-effective assembly. In addition, you have the option to package the items in ESD blister tape, optionally with Kapton stickers or completely in your desired packaging.
Application possibilities
For mounting and fixing of switches, fuses, etc.
Application possibilities
For mounting and fixing of switches, fuses, etc.
The (LF) PowerOne Powerelements are ideal for attaching components such as fuses, switches and much more to the PCB. Learn more about these and other interconnect solutions now.
Processing options for (LF) PowerOne Powerelements
MPFT (Massive Press Fit Technology)
Massive press-fit technology is the process of pressing solid pins into an electrically plated-through hole in a printed circuit board. Powerelements for press-fit technology have excellent mechanical and electrical properties, making them ideal for use in harsh environments such as high temperature fluctuations or vibration. The press-fit process creates a high performance, gas-tight cold welded connection with a contact resistance of just a few μOhm. This ensures very high current carrying capacity through low resistance contact points.
PCB design
Printed circuit boards must be designed in accordance with the latest edition of IPC A 600. In the case of solid press-fit technology, the PCBs must be designed in accordance with the Würth Elektronik ICS Press-fit Specification. Special attention should be paid to hole diameter and copper thickness.
SMT (Surface Mount Technology)
SMT is the process by which the component is soldered to the surface of the PCB. The solder paste is applied using a stencil, and unlike to the massive press-fit technology, the solder pad is electrically connected to the different layers of the PCB via vias as standard.
PCB design recommendations
PCBs should be designed in accordance with the latest edition of IPC A 600. Footprint specifications are available.
THR (Through Hole Reflow)
The THR process is based on the SMT process. In the THR process the pins are placed in the through-holes in the PCB, that are filled with solder paste. Similar to the SMT process, the solder paste is applied using a stencil. The paste melts in the oven and the pins are soldered into the holes.
PCB design recommendations
Printed circuit boards should be designed in accordance with the latest edition of IPC A 600. Footprint specifications are available.
THT (Through Hole Technology)
The THT process involves soldering solid pins into electrically plated-through holes in a printed circuit board. A distinction is made between wave soldering and selective soldering. In the former, the entire board is passed over a tin wave. In the selective soldering, the solder joints are approached individually with a tin crucible. The contact resistance of the solder joint is higher compared to the massive press-fit technology. This can affect the current carrying capacity.
PCB design recommendations
Printed circuit boards should be designed in accordance with the latest edition of IPC A 600. Footprint specifications are available.
Further information
Torques
Torque values for the various thread dimensions are listed on the Technology section. Different material combinations or thread lengths for bushings are not considered. Depending on the thread length, the bushings can be tightened to higher torques. Please note that self-locking nuts are not permitted for LF PowerPlus Powerelements.
Current carrying capacity
The current carrying capacity must always be considered in the context of the overall system. Our measurements have shown that the limiting factor is usually the PCB layout or the connection of external leads (contact resistance press-in zone 100-200 μΩ).
Qualification
(LF) PowerOne Press-fit and SMD high current contacts have successfully passed the vibration and mechanical shock tests according to ISO 16750-3.
Vibration test according to ISO 16750-3:2012 4.1.2.7 Random test VII.
Mechanical shock test according to ISO 16750-3:2012 4.2.3 Severity 2.
Accessories
PowerCover anti-torsion and anti-touch elements
Accessories
PowerCover anti-torsion and anti-touch elements
The PowerCover product group offers a wide range of anti-torsion and anti-touch elements. Various designs are available as shields, some with features integrated into the Powerelements. They all have one thing in common: More safety!
FAQs
In general, forces of 40 to 250 N per pin can be expected. This can vary depending on the Powerelement, PCB hardness, surface and hole quality of the PCB.
Yes, all PowerOne Powerelements are also available in the lead-free "LF" versions.
Yes, our Powerelements are produced with a special date code. This allows us to track the production batches if necessary.
