Product collage of LF PowerPlus 2.0 Powerelements on green background

LF PowerPlus

LF PowerPlus

The plus for your power electronics

Ideal for increased torque requirements, lower weight requirements, and automated processing operations

LF PowerPlus are high torque lead-free Powerelements from Würth Elektronik ICS with high torque. Thanks to their brass base body and a stainless steel screw element, they offer maximum torque with comparatively low weight. The screw tip allows easy insertion and positioning of the nut. This creates the ideal conditions for automatic screw fastening. Due to the special design of the base body, you can also equip the power supply elements on both sides in the same position. 

Depending on the pin arrangement and the corresponding layout, currents of up to 400 Amps are possible.

Product overview LF PowerPlus (PDF)

Thumbnail TECH TALK

Key information at a glance

Application possibilities

  • Contacting/ fastening of switches, fuses, etc. (especially with high torques)
  • Wire-to-board for screwing ring terminals
  • Board-to-board

From sample to market

Samples are available even in small quantities.
Just let us know what you need!

Packaging

Flexible packaging options: bulk, trays or in blister on reel for cost-effective assembly. In addition, you have the option to package the items in ESD blister tape, optionally with Kapton stickers or completely in your desired packaging.

Processing options for LF PowerPlus Powerelements

MPFT (Massive Press Fit Technology)

Massive press-fit technology is the process of pressing solid pins into an electrically plated-through hole in a printed circuit board. Powerelements for press-fit technology have excellent mechanical and electrical properties, making them ideal for use in harsh environments such as high temperature fluctuations or vibration. The press-fit process creates a high performance, gas-tight cold welded connection with a contact resistance of just a few μOhm. This ensures very high current carrying capacity through low resistance contact points.

PCB design 

Printed circuit boards must be designed in accordance with the latest edition of IPC A 600. In the case of solid press-fit technology, the PCBs must be designed in accordance with the Würth Elektronik ICS Press-fit Specification. Special attention should be paid to hole diameter and copper thickness.

THT (Through Hole Technology)

The THT process involves soldering solid pins into electrically plated-through holes in a printed circuit board. A distinction is made between wave soldering and selective soldering. In the former, the entire board is passed over a tin wave. In the selective soldering, the solder joints are approached individually with a tin crucible. The contact resistance of the solder joint is higher compared to the massive press-fit technology. This can affect the current carrying capacity.

PCB design recommendations 

Printed circuit boards should be designed in accordance with the latest edition of IPC A 600. Footprint specifications are available. 

Collection of product images of articles of the type press-fit tool for LF PowerPlus 2.0 Powerelements in header format

Einpresswerkzeug für LF PowerPlus 2.0

Einpresswerkzeug für LF PowerPlus 2.0

Suitable press-fit tools are required for LF PowerPlus 2.0 Powerelements. All information and instructions for their use during installation and optimum processing of the LF PowerPlus 2.0 Powerelements can be found here.

Further information

Torques

Torque values for the various thread dimensions are listed on the Technology section. Different material combinations or thread lengths for bushings are not considered. Depending on the thread length, the bushings can be tightened to higher torques. Please note that self-locking nuts are not permitted for LF PowerPlus Powerelements.

Current carrying capacity

The current carrying capacity of a press-fit connection must always be considered in the context of the overall system. The press-fit zone has an extremely low contact resistance of 100-200 μΩ, so that the limiting factor is usually to be found in the layout of the PCB or the connection of external leads.

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